1.Master control:
USB 2.0:Alcor, Chipsbank , SMI，MW.
USB 3.0:SMI,INNOSTOR
2.Flash brand.
Brand：Samsung,Inter, Hynix,Micron, Toshiba,Sandisk
Type：SLC,MLC,TLC
SLC = Single-Level Cell , 1bit/cell ， high speed with long
life,expensive,100 thousand times plug and play
MLC = Multi-Level Cell,2bit/cell,standard speed and life,not so
expensive,around 3000-10000 times plug and play
TLC = Trinary-Level Cell ， 3bit/cell ， low speed with short
life,cheaper,around 500 times plug and play
Actually Samsung or Sandisk,hynix are same,the chip quality based
on chip type(SLC,MLC or TLC)
3.IC package:TSOP、BGA、COB
TSOP:Thin Small Outline Package,SMT+PCBA,stability and high
yield,many USB factory will use this package.
BGA:ball grid array,SMT+PCBA,Some original chip use will this
package.
COB:chip on board,like bulk packing,But the packaging density is not
good compared with TSOP and BGA.
4.When cut and pack chip will generate different chip:
When cutting chip,will generate two kinds of chips,one is
good,another one is broken.
Original chip:original factory cutting it successfully.
Good die:the original factory cutting it successfully,but when
packing will generate some rejects,others will fix and pack it,it’s the
second packing,It is also very good.
White chip:when finished the second packing,also will generated
some rejects,they will fix them,this called white chip,also called ink
die.
Down(black) chip:original factory cutting it unsuccessfully.
So if you want to choose the good chip,you need to see the stability
and speed,capacity.
